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Tag: 5nm

Single Vs. Multi-Patterning Advancements For EUV

As semiconductor devices become more complex, so do the methods for patterning them. Ever-smaller features at each new node require continuous advancements in photolithography...

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Meta’s next-gen AI chip serves up ads while sipping power

After teasing its second-gen AI accelerator in February, Meta is ready to spill the beans on this homegrown silicon, which is already said to...

2024 Outlook with Elad Alon of Blue Cheetah Analog Design – Semiwiki

We have been working with Blue Cheetah Analog Design for three years now with great success. With new process nodes coming faster than ever...

2.5D Integration: Big Chip Or Small PCB?

Defining whether a 2.5D device is a printed circuit board shrunk down to fit into a package, or a chip that extends beyond the...

ISS 2024 – Logic 2034 – Technology, Economics, and Sustainability – Semiwiki

For the 2024 SEMI International Strategy Symposium I was challenged by members of the organizing committee to look at where logic will be in...

proteanTecs Addresses Growing Power Consumption Challenge with New Power Reduction Solution – Semiwiki

proteanTecs is a unique company, delivering electronics visibility from within. Its core mission is to enable the electronics industry to continue to scale. The...

Giving Back – The Story of One Silicon Valley Veteran’s Journey – Semiwiki

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Industry Luminaries Highlight Opportunities For Advancing The Non-EUV Leading Edge

The eBeam Initiative’s 12th annual Luminaries survey in 2023 reported a range of nodes from >5nm to 14nm as the most advanced non-EUV nodes...

CEO Interview: Sridhar Joshi of TenXer – Semiwiki

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A Fast Path to Better ARC PPA through Fusion Quickstart Implementation Kits and DSO.AI – Semiwiki

Synopsys recently presented a webinar on using their own software to optimize one of their own IPs (an ARC HS68 processor) for both performance...

Improving The Retention Characteristics Of 3D NAND Flash Memories

A technical paper titled “3D NAND Flash Memory Cell Current and Interference Characteristics Improvement With Multiple Dielectric Spacer” was published by researchers at Myongji...

What Will That Chip Cost?

In the past, analysts, consultants, and many other experts attempted to estimate the cost of a new chip implemented in the latest process technology....

Placement and Clocks for HPC – Semiwiki

You are probably familiar with the acronym PPA, which stands for Power/Performance/Area. Sometimes it is PPAC, where C is for cost, since there is...

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