Tag: 5nm

Jack Dorsey Goes All In. Could Bluesky and His Bitcoin Mining Chip Revolutionize Web3?

BlockchainMay 1, 2023

Jack Dorsey is shaking up the web3 industry with his initiatives. The former Twitter CEO’s Fintech company is preparing to launch a groundbreaking mining...

Report: Apple Racing to Build Software & Services for Upcoming Mixed Reality Headset

AR/VRApril 19, 2023

Apple appears to be getting ready to unveil its first mixed reality headset at its Worldwide Developers Conference (WWDC) in June. Now...

Report: Apple Mixed Reality Headset Delayed to Late 2023 Amid Decreased Confidence in Market Appeal

AR/VRMarch 30, 2023

Ming-Chi Kuo, a respected supply chain analyst, reports that Apple is tamping down enthusiasm for its upcoming mixed reality headset, which was...

There’s one sure winner in the AI explosion, say analysts: Dutch outfit ASML

AIMarch 24, 2023

Dutch semiconductor equipment vendor ASML is likely to benefit heavily from the rapid adoption of generative AI and machine learning technologies. Financial analysis firm Jefferies...

Lithography Resolution Limits: The Point Spread Function

SemiconductorMarch 21, 2023

The point spread function is the basic metric defining the resolution of an optical system . A focused spot will have a diameter defined...

Report: Apple’s MR Headset Could Come as Soon as This Summer

AR/VRMarch 13, 2023

Apple’s upcoming mixed reality headset has been the subject of many reports and rumors over the past few years—that’s just the nature...

Semtech, Broadcom demonstrate 200G/lane electrical-to-optical link at OFC 2023

IOTMarch 6, 2023

Camarillo, United States – Semtech Corporation, a high-performance semiconductor, IoT systems and cloud connectivity service provider, has announced the demonstration of a 200G per...

Resolution vs. Die Size Tradeoff Due to EUV Pupil Rotation

SemiconductorMarch 2, 2023

The many idiosyncrasies of EUV lithography affect the resolution that can actually be realized. One which still does not get as much attention as...

How To Build Resilience Into Chips

AutomotiveFebruary 27, 2023

Disaggregating chips into specialized processors, memories, and architectures is becoming necessary for continued improvements in performance and power, but it’s also contributing to unusual...

IEDM 2023 – 2D Materials – Intel and TSMC

SemiconductorFebruary 20, 2023

Intel and TSMC make up two of the three leading edge logic companies. At IEDM held in December 2022, Intel presented a paper on...

Process Innovations Enabling Next-Gen SoCs and Memories

SemiconductorFebruary 20, 2023

Achieving improvements in performance in advanced SoCs and packages — those used in mobile applications, data centers, and AI — will require complex and...