The present trends in technology — such as increasing demand for computational power from CPUs and GPUs, connectivity driven by Internet of Things (IoT),...
Continuing the multiphysics theme, I talked recently with Melika Roshandell (Product Management Director at Cadence) on the continuing convergence between MCAD and ECAD. You...
The lines between counterfeiting, security, and design flaws are becoming increasingly difficult to determine in advanced packages and process nodes, where the number of...
The increasing challenges and rising cost of logic scaling, along with demands for an increasing number of features, are pushing more companies into advanced...
Chipmakers are utilizing both evolutionary and revolutionary technologies to achieve orders of magnitude improvements in performance at the same or lower power, signaling a...
The Design Automation Conference (DAC) 2023 and Semicon West returned in full force this week, drawing in more attendees and sponsor companies than since...
In the 3D-IC (Three-dimensional integrated circuit) chip design method, chiplets or wafers are stacked vertically on top of each other and are connected using...
Creating real 3D designs is proving to be much more complex and difficult than 2.5D, requiring significant innovation in both technology and tools.
While there...
“Escalating demand for smaller, lighter, and more powerful electronics products and high-performance computing applications in server networks, artificial intelligence, mobile electronics,...
By Kelly Damalou and Matt Commens
Innovation in semiconductor design today is energized primarily by AI/ML, data centers, autonomous and electric vehicles, 5G/6G, and...
