By Keith Felton and Todd Burkholder
The time of 3D integrated circuits (3D ICs) is here, and they will revolutionize the semiconductor industry and effect...
Let’s face it, designs are getting harder, much harder. Gone are the days when the electrical and mechanical design of a system occurred separately....
In-vehicle networks are starting to migrate from domain architectures to zonal architectures, an approach that will simplify and speed up communication in a vehicle...
The lines between counterfeiting, security, and design flaws are becoming increasingly difficult to determine in advanced packages and process nodes, where the number of...
In the past, analysts, consultants, and many other experts attempted to estimate the cost of a new chip implemented in the latest process technology....
Experts at the Table: Semiconductor Engineering sat down to discuss the challenges of cost-dependent cloud decisions, and how to navigate between different EDA vendor...
Concerns about counterfeit chips are growing as more chips are deployed in safety- and mission-critical applications, prompting better traceability and new and inexpensive solutions...
The automotive supply chain is becoming more complex and collaborative, changing longstanding relationships between automakers and their suppliers in ways would have seemed unimaginable...
TOKYO, Aug 23, 2023 - (JCN Newswire) - Fujitsu, Information Services International-Dentsu, Ltd. (hereinafter ISID) and DIGITAL PROCESS LTD. (hereinafter DIPRO) today announced a...
Safety is emerging as a concern across an increasing number of industries, but standards and methodologies are not in place to ensure electronic systems...
