For many years, monolithic chips defined semiconductor innovation. New microprocessors defined new markets, as did new graphics processors, and cell-phone chips. Getting to the...
Creating real 3D designs is proving to be much more complex and difficult than 2.5D, requiring significant innovation in both technology and tools.
While there...
“Escalating demand for smaller, lighter, and more powerful electronics products and high-performance computing applications in server networks, artificial intelligence, mobile electronics,...
Redistribution layers (RDLs) are used throughout advanced packaging schemes today including fan-out packages, fan-out chip on substrate approaches, fan-out package-on-package, silicon photonics, and 2.5D/3D...
A thorough evaluation on selecting a bondable laser release material for redistribution layer (RDL)-first and die-first fan-out wafer-level packaging (FOWLP) is presented in this...
