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ISS 2024 – Logic 2034 – Technology, Economics, and Sustainability – Semiwiki

For the 2024 SEMI International Strategy Symposium I was challenged by members of the organizing committee to look at where logic will be in...

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Gate Resistance in IC design flow

MOSFET gate resistance is a very important parameter, determining many characteristics of MOSFETs and CMOS circuits, such as: • Switching speed• RC delay• Fmax –...

Taming Corner Explosion In Complex Chips

There is a tenuous balance between the number of corners a design team must consider, the cost of analysis, and the margins they insert...

IEDM 2023 – 2D Materials – Intel and TSMC

Intel and TSMC make up two of the three leading edge logic companies. At IEDM held in December 2022, Intel presented a paper on...

Process Innovations Enabling Next-Gen SoCs and Memories

Achieving improvements in performance in advanced SoCs and packages — those used in mobile applications, data centers, and AI — will require complex and...

Transistors repurposed as microchip ‘clock’ address supply chain weakness

Jan 25, 2023 (Nanowerk News) Microchip fab plants in the United States can cram billions of data processing transistors onto a tiny silicon chip,...

IEDM 2022 – TSMC 3nm

TSMC presented two papers on 3nm at the 2022 IEDM; “Critical Process features Enabling Aggressive Contacted Gate Pitch Scaling for 3nm CMOS Technology and...

IEDM 2022 – Ann Kelleher of Intel – Plenary Talk

Ann Kelleher is Intel’s Executive Vice President, General Manager, Technology Development, and she gave the first plenary talk to kick off the 2022 IEDM,...

Why Silent Data Errors Are So Hard To Find

Cloud service providers have traced the source of silent data errors to defects in CPUs — as many as 1,000 parts per million —...

Near-Threshold Computing Gets A Boost

Near-threshold computing has long been used for power-sensitive devices, but some surprising, unrelated advances are making it much easier to deploy. While near-threshold logic has...

Highly Selective Etch Rolls Out For Next-Gen Chips

Manufacturing 3D structures will require atomic-level control of what's removed and what stays on a wafer.

The post Highly Selective Etch Rolls Out For Next-Gen Chips appeared first on Semiconductor Engineering.

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