The increasing challenges and rising cost of logic scaling, along with demands for an increasing number of features, are pushing more companies into advanced...
Redistribution layers (RDLs) are used throughout advanced packaging schemes today including fan-out packages, fan-out chip on substrate approaches, fan-out package-on-package, silicon photonics, and 2.5D/3D...
Traditional metrics for semiconductors are becoming much less meaningful in the most advanced designs. The number of transistors packed into a square centimeter only...
Chipmakers are gearing up for fundamental changes in architectures, materials, and basic structures like transistors and interconnects. The net result will be more process...
Variation is becoming increasingly problematic as chip designs become more heterogeneous and targeted by application, making it difficult to identify the root cause of...
A thorough evaluation on selecting a bondable laser release material for redistribution layer (RDL)-first and die-first fan-out wafer-level packaging (FOWLP) is presented in this...
