In the dynamic realm of technological innovation, collaborations and partnerships often serve as catalysts for groundbreaking advancements. Continuing along this trajectory, Ansys, a global...
Anna has more than 25 years of expertise in managing complex R&D organizations and programs, giving birth to a number of innovative EDA technologies....
Chiplets are a disruptive technology. They change the way chips are designed, manufactured, tested, packaged, as well as the underlying business relationships and fundamentals....
The Design Automation Conference (DAC) 2023 and Semicon West returned in full force this week, drawing in more attendees and sponsor companies than since...
Highlights:
Ansys CTO Prith Banerjee will be delivering the Visionary Speaker opening address on Tuesday 11th
There will be technical presentations every hour in the...
As one of the world’s leading chip foundries, Samsung occupies a vital position in the semiconductor value chain. The annual Samsung Advanced Foundry Ecosystem...
In the 3D-IC (Three-dimensional integrated circuit) chip design method, chiplets or wafers are stacked vertically on top of each other and are connected using...
Creating real 3D designs is proving to be much more complex and difficult than 2.5D, requiring significant innovation in both technology and tools.
While there...
Vendor/PartnerClient, CountryProduct/Service (Duration & Value)AwardedSourceABRINT DSA, Broadcom, CiscoCollaboration to boost use of Wi-Fi in 6 GHz band in Brazil.2,23Full DetailsActelis City of Eugene, OregonSelected by City...
The explosion in volume and consumption of data, fueled by industry trends in virtualization, networking, and computing among others, continues to push photonic solutions...
