A technical paper titled “On hardware security and trust for chiplet-based 2.5D and 3D ICs: Challenges and Innovations” was published by researchers at STMicroelectronics Crolles (ST-CROLLES), Département Systèmes et Circuits Intégrés Numériques (DSCIN), Techniques de l’Informatique et de la Microélectronique pour l’Architecture des systèmes intégrés (TIMA), and Laboratoire Systèmes-sur-puce et Technologies Avancées (LSTA).
Abstract Excerpt:
“In this survey, we introduce the different types of 3DICs and their production chain. We then define the threats that threaten the different steps of the 3DIC manufacturing process. Finally, we present and discuss the state of the art in hardware S&T techniques for chiplet-based 3DICs.”
Find the technical paper here. Published November 2023.
Suzano Juan, Abouzeid Fady, Di Natale Giorgio, Philippe Anthony, Roche Philippe. On hardware security and trust for chiplet-based 2.5D and 3D ICs: Challenges and Innovations. 2023. ⟨hal-04309444⟩
Related Reading
Chiplets: 2023 (EBook)
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Data Leakage In Heterogeneous Systems
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Chiplet Security Risks Underestimated
The magnitude of the security challenges for commercial chiplets is daunting.
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- Source: https://semiengineering.com/challenges-and-innovations-of-hw-security-and-trust-for-chiplet-based-2-5d-and-3d-ics/
