By Liz Allan, Jesse Allen, and Karen Heyman
Global semiconductor equipment billings dipped 2% year-over-year to US$25.8 billion in Q2, and slipped 4% compared with...
Smaller process nodes, coupled with a continual quest to add more features into designs, are forcing chipmakers and systems companies to choose which design...
The future of semiconductor technology is often viewed through the lenses of photolithography equipment, which continues to offer better resolution for future process nodes...
The interdependence of semiconductor devices and companies in manufacturing was a recurring theme at this year’s SEMICON West, both in presentations and one-on-one discussions....
The Design Automation Conference (DAC) 2023 and Semicon West returned in full force this week, drawing in more attendees and sponsor companies than since...
Many companies reported revenue growth in the most recent quarter, but the latest round of chip industry earnings releases reflected some major themes:
Demand for...
Improved testability, coupled with more tests at more insertion points, are emerging as key strategies for creating reliable, heterogeneous 2.5D and 3D designs with...
Chipmakers are gearing up for fundamental changes in architectures, materials, and basic structures like transistors and interconnects. The net result will be more process...
Variation is becoming increasingly problematic as chip designs become more heterogeneous and targeted by application, making it difficult to identify the root cause of...
Parties are coming together, generating guidelines for sharing data from IC design and manufacturing through end of life, setting the stage for true end-to-end...
Emphasis shifts from speed to reliability and customization, slowing various process steps and when they are performed; sidelined equipment gains traction.
