News: Microelectronics 9 December 2022 At the 68th annual IEEE International Electron Devices Meeting (IEDM 2022) in San Francisco (3–7 December), Japan-based Toshiba Electronic...
Electronic systems in space are exposed to many hazards. Among other things, without the Earth’s protective magnetic field deflecting particles and our atmospheric blanket...
News: Microelectronics 1 December 2022 In a signing ceremony at its headquarters in Kyoto, Japan-based power semiconductor device maker ROHM Co Ltd has entered...
News: Microelectronics 22 November 2022 Japan’s ROHM has signed a joint development agreement with Mazda MotorCorp and Imasen Electric Industrial Co Ltd for inverters...
News: Microelectronics 21 November 2022 China’s Sanan Optoelectronics Co Ltd says that its subsidiary Hunan Sanan has signed a procurement letter of intent (LOI)...
A new technical paper titled “Perspective on radiation effects in nanoscale metal–oxide–semiconductor devices” was published by a researcher at Vanderbilt University, Nashville, Tennessee. The...
New technical paper titled “A First-Principles Study on the Electronic, Thermodynamic and Dielectric Properties of Monolayer Ca(OH)2 and Mg(OH)2,” from University of Texas at...
Technical paper titled “Bias Temperature Instability of MOSFETs: Physical Processes, Models, and Prediction” from researchers at Liverpool John Moores University.
Abstract“CMOS technology dominates the semiconductor...
Silicon carbide is gaining traction in the power semiconductor market, particularly in electrified vehicles, but it’s still too expensive for many applications.
The reasons are...
