In the 3D-IC (Three-dimensional integrated circuit) chip design method, chiplets or wafers are stacked vertically on top of each other and are connected using...
Plasma etching is perhaps the most essential process in semiconductor manufacturing, and possibly the most complex of all fab operations next to photolithography. Nearly...
Vendor/PartnerClient, CountryProduct/Service (Duration & Value)AwardedSourceABRINT DSA, Broadcom, CiscoCollaboration to boost use of Wi-Fi in 6 GHz band in Brazil.2,23Full DetailsActelis City of Eugene, OregonSelected by City...
The Biden Administration’s export bans for semiconductor manufacturing equipment are delaying expansion plans for Chinese chipmakers, Nikkei Asia reports. Yangtze Memory Technologies (YMTC) has...
This website uses cookies to improve your experience while you navigate through the website. The cookies that are categorized as necessary are stored on...
Technical paper titled “Microstructure Development of Cu/SiO₂ Hybrid Bond Interconnects After Reliability Tests” from researchers at TU Dresden and others.
Abstract:“The focus of this...
