New technical paper titled “A Scalable Emulator for Quantum Fourier Transform Using Multiple-FPGAs With High-Bandwidth-Memory” from researchers at Tohoku University in Japan.
Abstract:“Quantum computing is...
Placing multiple chips into a package side-by-side can alleviate thermal issues, but as companies dive further into die stacking and denser packaging to boost...
The chip industry is making progress on standardizing the infrastructure for chiplets, setting the stage for faster and more predictable integration of different functions...
Chipmakers are paying much closer attention to various DRAM options as they grapple with what goes on-chip or into a package, elevating attached memory...
