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Tag: D2S

Chip Industry Technical Paper Roundup: March 26

Industry Research ...

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High-NA Lithography Starting To Take Shape

The future of semiconductor technology is often viewed through the lenses of photolithography equipment, which continues to offer better resolution for future process nodes...

DAC/Semicon West Addresses Top Issues, Trends For Chips

The Design Automation Conference (DAC) 2023 and Semicon West returned in full force this week, drawing in more attendees and sponsor companies than since...

Relive Your Best Mountain Bike Descents on a Vintage Aircraft Altitude Indicator #Python

Glen Akins uses a Python script and an updated version of a digital-to-synchro project to replay mountain bike climbs and descents at 60x real...

Multi-Beam Mask Writers Are A Game Changer

The eBeam Initiative’s 11th annual Luminaries survey in 2022 reported strong purchasing predictions for multi-beam mask writers, enabling both EUV and curvilinear photomask growth....

SiPs: The Best Things in Small Packages

System-in-package (SiP) is quickly emerging as the package option of choice for a growing number of applications and markets, setting off a frenzy of...

Why Changes In Computing Are Driving Changes In Photomasks

Aki Fujimura, CEO of D2S, talks with Semiconductor Engineering about massive improvements in computation based upon increased density on chips, and why printing Manhattan...

How To Compare Chips

Traditional metrics for semiconductors are becoming much less meaningful in the most advanced designs. The number of transistors packed into a square centimeter only...

Big Changes In Architectures, Transistors, Materials

Chipmakers are gearing up for fundamental changes in architectures, materials, and basic structures like transistors and interconnects. The net result will be more process...

For The Love Of Theatre And Mask-Making

Naoya Hayashi has been a friend and important contributor to the eBeam Initiative from our start over 13 years ago. We’re just one of...

Variation Making Trouble In Advanced Packages

Variation is becoming increasingly problematic as chip designs become more heterogeneous and targeted by application, making it difficult to identify the root cause of...

High-NA EUV May Be Closer Than It Appears

High-NA EUV is on track to enable scaling down to the Angstrom level, setting the stage for chips with even higher transistor counts and...

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