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Tag: 300mm

Week In Review: Semiconductor Manufacturing & Test

The Biden Administration’s export bans for semiconductor manufacturing equipment are delaying expansion plans for Chinese chipmakers, Nikkei Asia reports. Yangtze Memory Technologies (YMTC) has...

MICLEDI highlights micro-LEDs for ultra-compact displays at SPIE AR-VR-MR

News: LEDs 1 February 2023 In booth #131 at SPIE AR-VR-MR at Photonics West 2023 in San Francisco (31 January – 1 February), MICLEDI...

icotec gets FDA clearance for extended VADER Pedicle System

<!----> Swiss medical device manufacturer icotec ag has received 510(k) clearance from the US Food and Drug Administration...

MICLEDI demos red AlInGaP micro-LEDs at CES, completing portfolio of RGB micro-LEDs

News: LEDs 6 January 2023 MICLEDI Microdisplays B.V. of Leuven, Belgium – a fabless developer of micro-LED display modules for augmented reality (AR) glasses...

Startup Funding: December 2022

The month of December saw six rounds of $100 million or more. The largest, at a massive half-billion dollars, will support manufacturing of 12-inch...

Adafruit’s Top Ten New Products of 2022 #AdafruitTopTen

Adafruit’s Top Ten New Products of 2022 #AdafruitTopTenWe did it! Another year! Here are our top ten new products of the year10. Socket Headers...

Micron Ugly Free Fall Continues as Downcycle Shapes Come into Focus

-Micron off the proverbial cliff and falling faster-Looking at a much longer/deeper decline in memory-Layoffs, capex cuts, slowdowns- battening down the hatches-Micron seems to...

MAC Operation on 28nm High-k Metal Gate FeFET-based Memory Array with ADC (Fraunhofer IPMS/GF)

A technical paper titled “Demonstration of Multiply-Accumulate Operation With 28 nm FeFET Crossbar Array” was published by researchers at Fraunhofer IPMS and GlobalFoundries. Abstract“This letter...

Wafer Shortage Improvement In Sight For 300mm, But Not 200mm

The supply chain for bare wafers is off-kilter. Demand is appreciably higher than the wafer suppliers can keep up with, creating shortages that could...

Highly Selective Etch Rolls Out For Next-Gen Chips

Manufacturing 3D structures will require atomic-level control of what's removed and what stays on a wafer.

The post Highly Selective Etch Rolls Out For Next-Gen Chips appeared first on Semiconductor Engineering.

Soitec expanding SmartSiC wafer manufacturing for EVs and industrial markets

Engineered substrate manufacturer Soitec has announced a new fabrication facility at its headquarters in Bernin, near Grenoble, France, primarily to manufacture new silicon carbide (SiC) wafers targeted at the electric vehicle (EV) and industrial markets. The extension will also support Soitec’s 300mm silicon-on-insulator (SOI) activities...

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