Zephyrnet Logo

Tag: 300mm

Building Better Bridges In Advanced Packaging

The increasing challenges and rising cost of logic scaling, along with demands for an increasing number of features, are pushing more companies into advanced...

Has U.S. already lost Chip war to China? Is Taiwan’s silicon shield a liability? – Semiwiki

Huawei’s 7NM chip? This wasn’t supposed to happen Are Chips a weapon for U.S. or China? Role reversal? Will Taiwan turn from protected asset to unwanted...

GlobiTech selects Aixtron’s G10-SiC CVD system for expansion into silicon carbide market

News: Suppliers 18 September 2023 Deposition equipment maker Aixtron SE of Herzogenrath, near Aachen, Germany says that it is supporting GlobiTech Inc of Sherman,...

Chip Industry Week In Review

By Liz Allan, Jesse Allen, and Karen Heyman Global semiconductor equipment billings dipped 2% year-over-year to US$25.8 billion in Q2, and slipped 4% compared with...

ASML Update SEMICON West 2023 – Semiwiki

ThreadsXFMvcEntityArrayCollection Object ( => Array ( => ThemeHouseXPressXFEntityThread Object ( => 51 => XFEntityThread => => Array ( )...

Applied Materials and Fraunhofer IPMS to create European metrology technology hub

News: Suppliers 17 July 2023 Process equipment maker Applied Materials Inc of Santa Clara, CA, USA and the Fraunhofer Institute for Photonic Microsystems (FhG...

Intel Internal Foundry Model Webinar – Semiwiki

Intel held a webinar today to discuss their IDM2.0 internal foundry model. On the call were Dave Zinsner Executive Vice President and Chief Financial...

Micron Mandarin Memory Machinations- CHIPS Act semiconductor equipment hypocrisy – Semiwiki

-We think China issue is overblown- Zero sum game theory-US should respond Tit-for-Tat and then some- Chop Chinese Chips-Chip equip makers duplicitous behavior- smacks...

IQE launches 200mm RGB epi for micro-LED display qualification

News: Suppliers 23 May 2023 Epiwafer and substrate maker IQE plc of Cardiff, Wales, UK has launched a new portfolio of 200mm (8”) red,...

SPIE 2023 – imec Preparing for High-NA EUV – Semiwiki

The SPIE Advanced Lithography Conference was held in February. I recently had the opportunity to interview Steven Scheer, vice president of advanced patterning process...

DENSO and USJC Announce Mass Production Shipment of Automotive IGBT, Targeting Expanding Electric Vehicle Market

Kariya, Kuwana, Japan/Hsinchu, Taiwan, May 10, 2023 - (JCN Newswire) - DENSO CORPORATION (DENSO), a leading mobility supplier, and United Semiconductor Japan Co., Ltd....

IEDM 2023 – 2D Materials – Intel and TSMC

Intel and TSMC make up two of the three leading edge logic companies. At IEDM held in December 2022, Intel presented a paper on...

Latest Intelligence

spot_img
spot_img