Improved testability, coupled with more tests at more insertion points, are emerging as key strategies for creating reliable, heterogeneous 2.5D and 3D designs with...
2.5D/3D integrated circuits (ICs) have evolved into an innovative solution for many IC design and integration challenges. As shown in figure 1, 2.5D ICs...
Semiconductor Engineering sat down to discuss why new approaches required for heterogeneous designs, with Bari Biswas, senior vice president for the Silicon Realization Group...
Semiconductor Engineering sat down to discuss what’s changing on the leading edge of design, and what’s needed to support those changes, with Bari Biswas,...
Placing multiple chips into a package side-by-side can alleviate thermal issues, but as companies dive further into die stacking and denser packaging to boost...
Nintendo revealed Metroid Dread, the first side-scrolling Metroid game with an original story in more than a decade, for the Nintendo Switch. The game...
