Hot spot cooling; scalable MatMul-free LLM; DfT for 3DIC; photonic ICs; high-density in-memory computing; self-assembly nano; LLM on-chip security verification.
New technical papers recently added to Semiconductor Engineering’s library.
| Technical Paper | Research Organizations |
|---|---|
| Thermoelectric active cooling for transient hot spots in microprocessors | University of Pittsburgh and Carnegie Mellon University |
| Scalable MatMul-free Language Modeling | UC Santa Cruz, Soochow University, UC Davis, and LuxiTech |
| SoCureLLM: An LLM-driven Approach for Large-Scale System-on-Chip Security Verification and Policy Generation | University of Florida |
| Design-for-Test Solutions for 3D Integrated Circuits | Duke University, Arizona State University, and NVIDIA |
| Bound-state-in-continuum guided modes in a multilayer electro-optically active photonic integrated circuit platform | NIST, University of Maryland, and Theiss Research |
| Low-Power Charge Trap Flash Memory with MoS2 Channel for High-Density In-Memory Computing | Kyungpook National University, Sungkyunkwan University, Dankook University, and Kwangwoon University |
| Self-assembly of nanocrystal checkerboard patterns via non-specific interactions | University of California San Diego and Duke University |
More Reading
Technical Paper Library home
Linda Christensen
Linda Christensen is vice president of operations and a contributing writer at Semiconductor Engineering.
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- Source: https://semiengineering.com/chip-industry-technical-paper-roundup-july-8/
