Exponential increases in data and demand for improved performance to process that data has spawned a variety of new approaches to processor design and...
The semiconductor industry is undertaking a major strategy shift towards multi-die systems. The shift is fueled by several converging trends:
Size of monolithic SoCs is...
Improved testability, coupled with more tests at more insertion points, are emerging as key strategies for creating reliable, heterogeneous 2.5D and 3D designs with...
Universal Chiplet Interconnect Express (UCIe) is an open specification that defines the interconnect between chiplets within a package. The objective is to enable an...
The chip industry is making progress on standardizing the infrastructure for chiplets, setting the stage for faster and more predictable integration of different functions...
