Skyworks Solutions, Inc has introduced the efficiency portfolio of Wi-Fi front-end modules (FEMs) addressing the power, performance and thermal requirements of Wi-Fi 6/6E-enabled devices...
Electronic systems in space are exposed to many hazards. Among other things, without the Earth’s protective magnetic field deflecting particles and our atmospheric blanket...
As the speed, density, and capabilities of electronics have all increased, power has become a first order driver in almost all electronic systems. For...
A new technical paper titled “A Thermal Machine Learning Solver For Chip Simulation” was published by researchers at Ansys.
Abstract“Thermal analysis provides deeper insights into...
The U.S. Patent and Trademark Office issued the following 203 patent registrations to businesses and individuals in Indiana during August 2022, based on applications...
New technical paper titled “Integrated Silicon Microfluidic Cooling of a High-Power Overclocked CPU for Efficient Thermal Management” is published by researchers at Georgia Tech...
New research paper titled “Review of Bumpless Build Cube (BBCube) Using Wafer-on-Wafer (WOW) and Chip-on-Wafer (COW) for Tera-Scale Three-Dimensional Integration (3DI)” from researchers at...
