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Cryptocurrency company, Luno has launched an early-stage investment arm, Luno Expeditions, to back fintech and crypto or web3 startups across the globe, according to an announcement from TechCrunch. Luno launches investment arm to back over 200 fintech and crypto/web3 startups yearly https://t.co/Jc4jLltUef by @ulonnaya — TechCrunch (@TechCrunch) March 16, 2022 The investment arm will fund between 200-300 startups annually and diversify beyond crypto into the broader fintech space. The fund will invest between $50,000 to $250,000 and dig out between $15 million to $75 million yearly which essentially means an investment between $50 million to $300 million range will be committed when looking at typical investment periods of funds of around three-four years. CEO Jocelyn Cheng will spearhead this new project as she leads an all-female team of five. She has prior experience in investing in the startup industry over the last six years as the managing director at Global Innovation Fund, an impact investment VC. “There are very few truly global and very early-stage fintech funds in the world; we see an exciting opportunity here to build one. The reason why it’s not just pure crypto is that over the past few years, as operators scaling some of the largest crypto businesses in the world, we have noticed that there is such a strong intersection between some of the traditional fintechs and crypto,” said Cheng. Venture Capital Firms Bullish on Crypto Companies Earlier last year, leading venture capital firms such as Paradigm and Andreessen Horowitz have launched crypto funds upto $2.2 billion and $3 billion respectively. Additionally, there have been more crypto funds from Hack VC, Electric Capital, Crypto.com, and Inflection, all launched within the last three months. Luno Expeditions has already invested in 20 crypto and fintech companies such as Nala, a Tanzanian remittance solution; Oraan, a digital bank for Pakistani women; Notabene, a crypto compliance solution in Israel. Others include African crypto exchange platform Busha and fintechs Stitch and Root.
Mark Zuckerberg’s Metaverse Artificial Intelligence Presentation Combining artificial intelligence with the metaverse creates a whole new world. The future is here. “The metaverse is barely being born. The opportunities to capitalize in this area are immense. Get involved and learn it quickly.” ~Dave Waters The Future is Here Artificial Intelligence & Machine Learning Quotes from [...]
Silicon Valley luminaries, led by Apple alumnus and NeXT Computer co-founder Rich Page, to support the company’s technology development, data and analytics, and consumer engagement strategy NEW YORK–(BUSINESS WIRE)–$PAVM #DigitalHealth—PAVmed Inc. (Nasdaq: PAVM, PAVMZ) (“PAVmed”), a diversified commercial-stage medical technology company today announced that its majority-owned digital health subsidiary Veris Health (“Veris”) has launched a […]
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For years, the PC industry has embraced the mixing and matching of processors, expansion cards, memory, and more, all to create a modular, expandable platform. Now, a group of companies wants to do that at the chip level in what's called Universal Chiplet Interconnect Express, or UCIe.
UCIe takes the concept of “chiplets”—individual pieces of self-contained logic, stitched together inside of a chip package—and opens it up to the semiconductor industry at large. Both AMD and Intel have done this for years: Intel with its co-EMIB and ODI connections, for example, which gave the world its hybrid chip, Alder Lake. A specialized engineering partnership between AMD and Intel also produced an Intel CPU that included an AMD GPU, called “Kaby Lake G“.
Enter UCIe, which is designed to make a future “Kaby Lake G” chip even easier to manufacture. UCIe transfers data using either the existing PCI Express standard or the related CXL (Compute Express Link) interface used by data centers. Essentially, a chip maker could take a CPU core from one company, a graphics core from another, and a WiFi radio or 5G radio front-end from a third chip company, and snap them together like LEGO blocks using UCIe, in much the same way you can drop a graphics card or an SSD into a PC's PCI Express slot. With UCIe, this would simply be done at the chip level. (A UCIe white paper (PDF) has more.)
The membership of UCIe backers includes a who's who of major chip and foundry vendors: AMD, Arm, Advanced Semiconductor Engineering, Inc. (ASE), Google Cloud, Intel, Meta/Facebook, Microsoft, Qualcomm, Samsung and TSMC. The exception? Nvidia, which has yet to formally sign on.
The new standard is also a concession of sorts, one that acknowledges the demands of today's designs simply exceed the industry's ability to physically manufacture them. For decades, the PC industry has tried to design all-in-one PC processors that contain a CPU, GPU, I/O, and more, all on a single chip. But larger and larger chips provide more opportunity for lithography errors that can render the entire chip worthless. Indeed, UCIe is built to anticipate the day when new, hybrid chips might simply be too physically large to manufacture using today's lithographic equipment.
“What we're seeing is that a lot of our designs are hitting the reticle limit as the demand for processing is insatiable, so it's easier for us—and by ‘us' I mean the broader industry—to build smaller chiplets and stitch them together on the package so that they act as a single entity,” UCIe chair and senior Intel fellow Debendra Das Sharma told HPCWire. “So this is a scale up kind of solution.”
Hypothetically, UCIe would mean that essentially anyone with the appropriate licenses and intellectual property could snap together a chip package containing logic from any number of companies. UCIe also suggests that any number of small startups could develop specialized logic, package them up with a UCIe interface, and sell them to other chip companies.
To be fair, the chip industry has already had this capability for decades, with programmable logic and FPGAs from companies like Altera and Xilinx—both recently acquired by Intel and AMD, interestingly enough. Which leads to an interesting speculation: In a decade or so, could Intel and AMD become the new “PC” builders?