Zephyrnet Logo

Tag: semiconductor packaging

UK funding of £14m for open-access power semiconductor test & packaging equipment

News: Microelectronics 28 March 2024 The UK Government has announced a £16.6m investment to give semiconductor researchers and businesses access to new...

Top News

How Does Semiconductor Technology Impact the Global Supply Chain? – Schain24.Com

Spread the love Abstract The industry`s annual semiconductor sales revenue has since grown to over $481 billion, as of 2018. In 2021, the...

Building Better Bridges In Advanced Packaging

The increasing challenges and rising cost of logic scaling, along with demands for an increasing number of features, are pushing more companies into advanced...

How Intel, Samsung and TSMC are Changing the World – Semiwiki

Given the changes in the music business, the term “Rock Star” doesn’t really have any relevance to music or its performers anymore.  Instead, we...

TSMC Redefines Foundry to Enable Next-Generation Products – Semiwiki

For many years, monolithic chips defined semiconductor innovation. New microprocessors defined new markets, as did new graphics processors, and cell-phone chips. Getting to the...

AUO Digitech Provides Smart Upgrades for Semiconductor Assembly and Packaging Plants

AUO Digitech with K&S and Leyu provides one-stop service solutions that target the issues faced by the semiconductor assembly and packaging field....

Plataine & NEPES Sign MoU to Jointly Develop and Market AI-Based…

“We will further increase productivity and dramatically reduce costs to become the best semiconductor factory in the world.” TEL AVIV,...

Startup Funding: December 2022

The month of December saw six rounds of $100 million or more. The largest, at a massive half-billion dollars, will support manufacturing of 12-inch...

Singapore-based Semiconductor Equipment and Materials Specialist Rokko Marks 30 Years of R&D Breakthroughs, Focus on Quality & Reliable Technical Support

SINGAPORE, Dec 13, 2022 - (ACN Newswire) - Rokko Holdings Ltd ("Rokko") has marked its 30th anniversary as a proven specialist in the global semiconductor industry, having overcome...

DuPont Launches CYCLOTENE™ Dry-Film Photo-Imageable Dielectric…

“Escalating demand for smaller, lighter, and more powerful electronics products and high-performance computing applications in server networks, artificial intelligence, mobile electronics,...

Cu/SiO₂ Hybrid Bond Interconnects

Technical paper titled “Microstructure Development of Cu/SiO₂ Hybrid Bond Interconnects After Reliability Tests” from researchers at TU Dresden and others. Abstract:“The focus of this...

Semiconductor Packaging History and Primer

From DIP to Advanced, semiconductor packaging has become strategic

For ease of reading – I am going to be splitting this primer into two parts. First is the technical overview of everything. Next will be the company-specific writeups that follow over time – specifically Teradyne, Formfactor, Advantest, and Camtek

Read More

The post Semiconductor Packaging History and Primer appeared first on SemiWiki.

X-ray Imaging of Silicon Die Within Fully Packaged Semiconductor Devices

A divergent beam and quasi-monochromatic radiation from a sealed X-ray tube can be used to perform warpage measurementsby XRDI in the laboratory.

The post X-ray Imaging of Silicon Die Within Fully Packaged Semiconductor Devices appeared first on Semiconductor Engineering.

Latest Intelligence

spot_img
spot_img