2D electrode for ultra-thin semiconductors
Researchers from the Korea Institute of Science and Technology (KIST), Japan’s National Institute for Materials Science, and Kunsan National University...
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Through glass vias
Researchers from the Chinese Academy of Sciences (CAS) developed a Through Glass Via (TGV) process for 3D advanced packaging, which they say...
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Algae-powered microprocessor
Engineers from the University of Cambridge, Arm Research, Scottish Association for Marine Science, and Norwegian University of Science and Technology used a widespread...
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Protein-based circuits
Researchers from North Carolina State University and University of Cambridge created self-assembled, protein-based circuits that can perform simple logic functions and take advantage...
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Photonic computing with polarization
Researchers at the University of Oxford and University of Exeter developed a method that uses the polarization of light to maximize...
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