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Tag: Low Power-High Performance

Current And Future Challenges For An Open Chiplet Ecosystem

Low Power-High Performance ...

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Blog Review: September 20

Systems & Design Rigid-flex PCBs; multi-physics effects on multi-die systems; chip design computation and storage requirements; AI memory challenges; modeling MOSFETs....

Reliability On The Rise In IC Design

Low Power-High Performance OPINION Aging simulation and electromigration analysis tests the long-term stability of designs in a virtual environment. ...

Research Bits: July 5

Low Power-High Performance UTe2 superconductor for topological quantum computing; new material for single-molecule electronic switches; graphene/seaweed sensors in electronic skin. ...

Research Bits: June 20

Low Power-High Performance Benefits of superconductor quantum computing in Helium-3 bath; lightweight vision system; nanodiamond nanosheets get rid of heat. ...

Improving Verification Predictability And Efficiency Using Big Data

Low Power-High Performance WHITEPAPERS Using cross-analytics between bug closure rates and source code churn to boost predictability. ...

Predictive Health Monitoring In Functional Safety

Functional safety first became a major issue for the semiconductor industry in 2011 with the introduction of the ISO 26262 standard for implementing functional...

Startup Funding: October 2022

Investors poured $3.5 billion into 113 startup companies in October 2022, especially new battery technology, AI hardware, and faster memory access. Battery technology dominated the...

HBM3 In The Data Center

Frank Ferro, senior director of product management at Rambus, talks about the forthcoming HBM3 standard, why this is so essential for AI chips and...

Foundational Changes In Chip Architectures

We take many things in the semiconductor world for granted, but what if some of the decisions made decades ago are no longer viable...

Research Bits: Oct. 4

2D electrode for ultra-thin semiconductors Researchers from the Korea Institute of Science and Technology (KIST), Japan’s National Institute for Materials Science, and Kunsan National University...

Coming In Hot: Requirements For Successful Thermal Management In 3D-IC

As the speed, density, and capabilities of electronics have all increased, power has become a first order driver in almost all electronic systems. For...

Research Bits: Sept. 27

Microchip detects antibodies with drop of blood A microchip developed by researchers at Georgia Tech and Emory University can detect antibodies in the blood with...

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