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Tag: Lehigh University

CCC Receives $5 Million NSF Award to Continue Catalyzing the Research Community » CCC Blog

The following originally appeared on the CRA Bulletin, written by Haley Griffin, Program Associate, CCC, and Matt Hazenbush, Director of Communications Following an intensive recompete process,...

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Sand that flows uphill, handwritten LEDs – Physics World

Although it seems like a mundane material, the rich and varied behaviour of sand has long fascinated physicists – from the...

CCC Responds to NTIA Request for Comment on AI Accountability Policy » CCC Blog

June 22nd, 2023 / in AI, Announcements, CCC / by Maddy Hunter Last month, the National Telecommunications and Information...

CCC at AAAS Panel Recap: “Maintaining a Rich Breadth for Artificial Intelligence” Q&A

This blog post is a continuation of yesterday’s summary of the Maintaining a Rich Breadth for Artificial Intelligence panel at the 2023 AAAS meeting....

Want to make better materials? Read between the lines. Or the ‘grain boundaries’, as they’re known in materials science

Apr 25, 2023 (Nanowerk News) The orientations of these infinitesimally small separations between individual “grains” of a polycrystalline material have big effects. In a...

AAAS Panel Recaps: Sustaining Computing Research Communities in a Hybrid World

Continuing in our AAAS panel recaps, the CCC hosted a panel titled, “Sustaining Computing Research Communities in a Hybrid World”. The panelists were Brent...

CCC Submits Response to the OSTP Request for Information on Digital Assets Research and Development

March 8th, 2023 / in CCC, NITRD, NSF, resources / by Catherine Gill On Friday of last week, the...

This New Material Absorbs Three Times More CO2 Than Current Carbon Capture Tech

According to the IEA, there are currently 18 direct air capture plants in operation around the world. They’re located in Europe, Canada, or the...

CCC Council Member Nominations Open

The Computing Community Consortium (CCC) is charged with enabling the pursuit of innovative, high-impact computing research that aligns with pressing national and global challenges....

Ready, Set, Go: Outrunning Moore’s Law With 3D-IC

By Anthony Mastroianni and Gordon Allan, Siemens EDA 3D ICs are an exciting and promising extension of heterogeneous advanced package technology into the third...

Technical Paper Round-Up: July 26

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Enabling More Profitable Home Delivery

After reading Adrian Gonzalez’s post “Delivery: Revisiting The Logistics Of Elevator Rides,” I thought I would help answer his question about how to achieve...

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