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Tag: DTCO

SPIE 2023 Buzz – Siemens Aims to Break Down Innovation Barriers by Extending Design Technology Co-Optimization – Semiwiki

Preventing the propagation of systematic defects in today’s semiconductor design-to-fabrication process requires many validation, analysis and optimization steps. Tools involved in this process can...

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IEDM 2022 – Ann Kelleher of Intel – Plenary Talk

Ann Kelleher is Intel’s Executive Vice President, General Manager, Technology Development, and she gave the first plenary talk to kick off the 2022 IEDM,...

TSMC OIP – Enabling System Innovation

On November 10th I watched the presentation by L.C. Lu, TSMC Fellow & VP, as he talked about enabling system innovation with dozens of...

Beyond 5nm: Review of Buried Power Rails & Back-Side Power

A new technical paper titled “A Holistic Evaluation of Buried Power Rails and Back-Side Power for Sub-5 nm Technology Nodes” is presented by researchers...

New End Markets, More Demand For Complex Chips

Experts at the Table: Semiconductor Engineering sat down to discuss economic conditions and how that affects chip design with Anirudh Devgan, president and CEO...

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