IBASE Technology will collaborate with Qualcomm Technologies to showcase next-generation edge AI solutions at the upcoming Embedded World 2024. The event will take placed on April 9-11, 2024, IBASE will be stationed at booth 3-351 in hall 3.

At the show, they will showcase their latest RM-QCS6490-S SOM module based on Qualcomm QCS6490 processor and RM-QCS610 SMARC 2.1 module based on the Qualcomm QCS610 processor, both supporting a range operating temperature from the lowest -25°C to the highest +80°C for harsh environments. These solutions deliver connections, performance and are designed for industrial IoT applications such as rugged handhelds and tablets, kiosks, POS and human-machine interface systems.

“Collaborating with IBASE, we are excited to showcase next-generation edge AI solutions powered by Qualcomm Technologies at Embedded World 2024,” said Dev Singh, a vice president of business development and head of building, enterprise and industrial automation at Qualcomm Technologies. “Our collaboration aims to deliver advanced computing capabilities for industrial IoT applications, enabling businesses to harness the power of AI in rugged environments.”

“IBASE has established a long-term collaboration with Qualcomm Technologies, working together to develop more advanced capabilities for customers in the field of edge AI deployments,” said Albert Lee, the president of IBASE. “We aim to deliver increasingly sophisticated and efficient AI-focused modules that empower businesses and industries worldwide. Through our ongoing collaboration, we are dedicated to shaping the edge computing landscape and ushering in a new era of possibilities and beyond.”

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