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Tag: TSVs

Ansys and Intel Foundry Direct 2024: A Quantum Leap in Innovation – Semiwiki

In the dynamic realm of technological innovation, collaborations and partnerships often serve as catalysts for groundbreaking advancements. Continuing along this trajectory, Ansys, a global...

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Ensuring 3D IC Semiconductor Reliability: Challenges and Solutions for Successful Integration – Semiwiki

One of the most promising advancements in the semiconductor field is the development of 3D Integrated Circuits (3D ICs). 3D ICs enable companies to...

CEO Interview: Anna Fontanelli of MZ Technologies – Semiwiki

Anna has more than 25 years of expertise in managing complex R&D organizations and programs, giving birth to a number of innovative EDA technologies....

Nvidia Enhances Grace Hopper Superchip with HBM3e Upgrade

Nvidia, the leading graphics processing unit (GPU) manufacturer, has recently announced an upgrade to its highly anticipated Grace Hopper superchip. The company has enhanced...

WEBINAR: Revolutionizing Chip Design with 2.5D/3D-IC design technology – Semiwiki

In the 3D-IC (Three-dimensional integrated circuit) chip design method, chiplets or wafers are stacked vertically on top of each other and are connected using...

How To Build Resilience Into Chips

Disaggregating chips into specialized processors, memories, and architectures is becoming necessary for continued improvements in performance and power, but it’s also contributing to unusual...

Chiplets Enter The Supercomputer Race

Nations compete on speed using very different compute architectures.

The post Chiplets Enter The Supercomputer Race appeared first on Semiconductor Engineering.

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