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Tag: Onto Innovation

Why Chiplets Are So Critical In Automotive

Chiplets are gaining renewed attention in the automotive market, where increasing electrification and intense competition are forcing companies to accelerate their design and production...

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Battling Over Shrinking Physical Margin In Chips

Smaller process nodes, coupled with a continual quest to add more features into designs, are forcing chipmakers and systems companies to choose which design...

DAC/SEMICON West 2023 Roundup

The interdependence of semiconductor devices and companies in manufacturing was a recurring theme at this year’s SEMICON West, both in presentations and one-on-one discussions....

Chip Industry’s Earnings Roundup

Many companies reported revenue growth in the most recent quarter, but the latest round of chip industry earnings releases reflected some major themes: Demand for...

Yield Is Top Issue For MicroLEDs

MicroLED display makers are marching toward commercialization, with products such as Samsung’s The Wall TV and Apple’s smart watch expected to be in volume...

How To Compare Chips

Traditional metrics for semiconductors are becoming much less meaningful in the most advanced designs. The number of transistors packed into a square centimeter only...

Hunting For Macro Defects: The Importance Of Bare Wafer Inspection

As logic and memory semiconductor devices approach the limits of Moore’s Law, the requirements for accuracy in layer transfer become increasingly stringent. One leading...

Making 5G More Reliable

The rollout of 5G is a complex and monumental effort involving multiple separate systems that need to function flawlessly together in real-time, making it...

Improving Yield With Machine Learning

Machine learning is becoming increasingly valuable in semiconductor manufacturing, where it is being used to improve yield and throughput. This is especially important in process...

Keeping IC Packages Cool

Placing multiple chips into a package side-by-side can alleviate thermal issues, but as companies dive further into die stacking and denser packaging to boost...

Removing Barriers For End-To-End Analytics

Parties are coming together, generating guidelines for sharing data from IC design and manufacturing through end of life, setting the stage for true end-to-end...

Highly Selective Etch Rolls Out For Next-Gen Chips

Manufacturing 3D structures will require atomic-level control of what's removed and what stays on a wafer.

The post Highly Selective Etch Rolls Out For Next-Gen Chips appeared first on Semiconductor Engineering.

Fundamental Shifts In IC Manufacturing Processes

Emphasis shifts from speed to reliability and customization, slowing various process steps and when they are performed; sidelined equipment gains traction.

The post Fundamental Shifts In IC Manufacturing Processes appeared first on Semiconductor Engineering.

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