TOKYO, Dec 12, 2023 - (JCN Newswire) - Hitachi High-Tech Corporation ("Hitachi High-Tech") announced today the launch of its GT2000 high-precision electron beam metrology...
Electron beam lithography is commercially used to directly write submicron patterns onto advanced node masks. With the advent of EUV masks and nanometer-scale NIL...
The move to curvilinear shapes on photomasks is gaining steam after years of promise as a way of improving yield, lowering defectivity, and reducing...
Extreme ultraviolet (EUV) lithography is often represented as benefiting from the 13.5 nm wavelength (actually it is a range of wavelengths, mostly ~13.2-13.8 nm),...
The future of semiconductor technology is often viewed through the lenses of photolithography equipment, which continues to offer better resolution for future process nodes...
Extreme ultraviolet (EUV) lithography systems are the most advanced lithography systems in use today. This article is a basic primer on this important yet...
Plasma etching is perhaps the most essential process in semiconductor manufacturing, and possibly the most complex of all fab operations next to photolithography. Nearly...
The SPIE Advanced Lithography Conference was held in February. I recently had the opportunity to interview Steven Scheer, vice president of advanced patterning process...
The eBeam Initiative’s 11th annual Luminaries survey in 2022 reported strong purchasing predictions for multi-beam mask writers, enabling both EUV and curvilinear photomask growth....
