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Tag: AI and 5G

Achieving Extreme Low Power with Synopsys Foundation IP Memory Compilers and Logic Libraries – Semiwiki

The relentless demand for lower power SoCs is evident across many markets.  Examples include cutting-edge mobile, IoT, and wearable devices along with the high...

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NEC to host NEC Visionary Week 2021

TOKYO, Aug 16, 2021 - (JCN Newswire) - NEC Corporation (NEC; TSE: 6701) today announced the Global Program for NEC Visionary Week 2021,...

VayuAI Corp. and Cycle Development, LLC enter into Agreement to Lead…

VayuAI Logo “Leveraging the respective strengths of the Cycle team and Vayu this joint venture creates a first-of-its-kind, repowering partnership,”...

Digital transformation will spur economic boom in 2021, CEOs tell Gartner

3D geolocation is transforming location technology From food delivery services to safety apps and gaming, learn how it's now...

CEA-Leti & Dolphin Design Report FD-SOI Breakthrough that Boosts Operating Frequency by 450% and Reduces Power Consumption by 30%: Joint Paper Presented at ISSCC...

Home > Press > CEA-Leti & Dolphin Design Report FD-SOI Breakthrough that Boosts Operating Frequency by 450% and Reduces Power Consumption by...

Wondering how AI and 5G are set to change your world?

Promo All the data in the world means nothing if you’re not getting it to the right place at the right time and...

3D ICs in Emerging Technologies: Consumer Electronics, ML & AI

The global market of  3D ICs was valued at US$ 7,521.4 Mn in 2019 and is forecasted to reach a value of US$ 38,252.9 Mn by 2027 at a CAGR of 22.5% between 2020 and 2027. The basic definition for 3D ICs is logic over the logic that is connected through TSV. This includes a

The post 3D ICs in Emerging Technologies: Consumer Electronics, ML & AI appeared first on .

Daimler and Ericsson Hit the Stage at XDF Frankfurt to Discuss Next-Gen Automotive AI and 5G Systems

Following on the heels of XDF San Jose and Beijing, this week’s XDF Frankfurt, which took place Monday, got off to an eventful...

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