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Secure Physical Design Roadmap Enabling End-To-End Trustworthy IC Design Flow

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The FICS Research Institute (University of Florida) has published a new research paper titled “Secure Physical Design.” This is the first and most comprehensive research work done in this area that requires significant attention from academia, industry, and government for ensuring trust in electronic design automation flow,” said lead author Sukanta Dey.

Abstract
“An integrated circuit is subject to a number of attacks including information leakage, side-channel attacks, fault-injection, malicious change, reverse engineering, and piracy. Majority of these attacks take advantage of physical placement and routing of cells and interconnects. Several measures have already been proposed to deal with security issues of the high level functional design and logic synthesis. However, to ensure end-to-end trustworthy IC design flow, it is necessary to have security sign-off during physical design flow. This paper presents a secure physical design roadmap to enable end-to-end trustworthy IC design flow. The paper also discusses utilization of AI/ML to establish security at the layout level. Major research challenges in obtaining a secure physical design are also discussed.”

Find the technical paper here. Published July 2022.

Proposed flow for secure physical design (SEPHYD) and secure physical design verification (SPDV) sign-off. Source: FICS, U of Florida “Secure Physical Design” paper.

Authors: Sukanta Dey, Jungmin Park, Nitin Pundir, Dipayan Saha, Amit Mazumder Shuvo, Dhwani Mehta, Navid Asadi, Fahim Rahman, Farimah Farahmandi, and Mark Tehranipoor
Cryptology ePrint Archive, Paper 2022/891, 2022.

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Find more security technical papers in SemiEngineering’s library here.

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