7 September 2020
The Compound Semiconductor Centre Ltd (CSC) – a joint venture founded in 2015 between Cardiff University and epiwafer foundry and substrate maker IQE plc of Cardiff, Wales, UK – has announced its involvement in two new projects funded by Innovate UK under the UK National Quantum Technologies Programme.
In July, CSC formally initiated a new £1.9m project in collaboration with partners including III-V optoelectronic foundry Compound Semiconductor Technologies Global Ltd (CST Global) of Glasgow, Scotland, UK, Cardiff University, semiconductor and MEMS device maker INEX Microtechnology Ltd of Newcastle -upon-Tyne, UK, National Physical Laboratory (NPL) and the University of Nottingham to develop a compact laser-pumped atomic magnetometer. The novel sensor correlates the interaction between alkali-metal atoms and an external magnetic field to infer minute changes in surface structures. This allows the detection of micro-defects in materials and objects that are not visible or hidden from view under protective coatings. A wide range of applications includes:
- detection of corrosion under insulation (which costs £4 trillion globally in downtime and repairs);
- in-line material characterization and quality control across the >£1.5bn steel industry;
- accurate detection of underground assets to reduce excavation time and cost during repairs and maintenance (such as transmission lines, gas and water pipes).
“The global non-destructive test market is worth £7bn annually, and higher-sensitivity in-line sensor solutions are desperately required to help meet the net-zero greenhouse-gas target by 2050 via reducing fugitive emissions in aging infrastructure, and increasing materials production efficiency,” says CSC project manager Denise Powell.
In August, CSC started work on a new £5.5m project with nine industry and academic partners led by British battery maker AMTE Power. CSC’s focus is on developing high-performance compound semiconductor laser sources for quantum magnetometers, to enable extremely high-sensitivity magnetic field measurements to grade new batteries leaving the factory and reduce the time taken for the ageing process from weeks to days. This new quantum sensing technology will cut the cost of production and provide additional capability in grading the quality of batteries for electric cars and other uses in the electrification revolution. An immediate application is integration in UK efforts to build a Gigafactory for battery production in the next few years, in anticipation of 50% of UK vehicle production being wholly or partially electric by 2030.
“We need radically new methods of battery assembly, testing and screening to enable truly high-volume battery manufacture to meet the demands of electrification of transport,” says CSC project manager Ali Anjomshoaa. “This project is a great example of the application of UK-derived quantum science to address real-world problems and drive the future of the British automotive, transport and energy industries,” he adds.
“These projects are the latest in a portfolio of innovative technologies that are translating quantum science into UK-based manufacturing to address new global opportunities,” says CSC director Wyn Meredith. “It is essential that we continue to focus on exploitation of our word-class research to keep the UK at the forefront of the industries of the future.”
Silanna Semiconductor Delivers on Groundbreaking Active Clamp Flyback…
The SZ1130 has seen exceptional customer demand. The technical sales team has been working directly with customers’ designs demonstrating the ACF controllers, delivering over 94% efficiency with an all-silicon design and 30 W/in3 power density at 65 W for universal input AC/DC power adapters.
SAN DIEGO (PRWEB) September 17, 2020
Silanna Semiconductor, The Power Density Leader, today announced the full production release of the industry-leading expanded portfolio of Active Clamp Flyback Controllers (ACF). Silanna Semiconductor focuses on the ultimate power management challenges with best-in-class power density and efficiency that delight customers with unprecedented BoM savings. First announced in April 2020, Silanna Semiconductor has achieved full production release of the SZ1130 ACF PWM controllers, delivering on the customer expectations and market penetration of Active Clamp Flyback Controllers.
SZ1130 devices are ACF controllers that integrate an adaptive digital PWM controller and the following Ultra High-Voltage (UHV) components: an Active Clamp FET, Active Clamp Gate Driver, and a Startup Regulator. This unprecedented integration level facilitates designing efficient, high-power-density adapters with low BoM cost to satisfy power-hungry mobile phones, tablets, notebooks, and video game consoles.
The SZ1130 has seen exceptional customer demand. The technical sales team has been working directly with customers’ designs demonstrating the ACF controllers, delivering over 94% efficiency with an all-silicon design and 30 W/in3 power density at 65 W for universal input AC/DC power adapters. All this, alongside the extensive AC/DC and DC/DC products are available at the demo room at https://www.powerdensity.com.
“We were looking for an extremely powerful product that can charge our devices very quickly. We established that the SZ1130 is very dense yet can handle up to 65 W of output power with quick charge applications,” said Tony Wu, Chief Technology Officer of Heytech, the Shenzhen based design house providing state-of-art power supply solutions to Major ODMs in China. “We feel confident using the SZ1130 due to the all-silicon design and 30 W/in3 power density at 65 W output power. Not only does this provide high speed, but the silicon has temperature resistant properties, which is of great importance to us.”
The device provides the ease-of-design of a simple flyback controller with all the benefits of an Active Clamp Flyback design, including recycling the leakage inductance energy of the flyback transformer and limiting the primary FET drain voltage spike during the turn-off events. Employing Silanna Semiconductor’s OptiModeTM digital control architecture, the SZ1130 adjusts the device’s mode of operation on a cycle-by-cycle basis to maintain high efficiency, low EMI, fast dynamic load regulation, and other key power supply parameters in response to varying line voltage and load. The SZ1130 is fully supported by the Silanna Semiconductor’s Asian Center of Excellence (ACE) design support center. The technical sales team and design software make the SZ1130 an easy option for customers.
“Unlike conventional ACF designs, tight tolerances of the clamp capacitor and leakage inductance values are not required for proper operation of the circuit in high volume production,” said Ahsan Zaman, Director of Marketing. “The SZ1130 is well-suited for high efficiency and high power density AC/DC power adapters. The devices are designed for 65 W (SZ1130) output power, including USB-PD and Quick Charge applications.”
SZ1130-based AC/DC power supplies easily meet the stringent DoE and CoC efficiency and no-load standby power requirements.
- Integrated UHV Active Clamp FET, Active Clamp Driver, and Start-up Regulator
-Capable of Over 94% Efficiency
- Flat Efficiency Across Universal (90 – 265 Vac) Input Voltage and Load
- Up to 146 kHz Switching Frequency Operation
- OptiMode™ Cycle-by-Cycle Adaptive Digital Control
- Self-Tuning Valley Mode Switching (VMS)
- Multi-Mode Operation (Burst Mode, QR, VMS)
- > 6dB EMI Margin
- OTP, OVP, OCP, OPP, and Output Short Circuit Protections
- < 50 mW No Load Power Consumption
- 65 W Output Power
- 16-pin SOIC Package
- High Power Density AC/DC Power Supplies
- High-Efficiency Power Adapters
- USB-PD/QC AC/DC Power Adapters
- Battery Chargers for Mobile Devices
Availability and Pricing:
Sample information and live demonstrations are available at https://www.powerdensity.com. For pricing inquiries, contact email@example.com.
Silanna Semiconductor: The Power Density Leader. Delivering on the ultimate Power Management challenge of best in class power density and efficiency performance that delights customers with unprecedented BoM savings. Silanna Semiconductor’s AC/DC and DC/DC power converter ICs are driving key innovations in Travel Adapters, Laptop Adapters, Appliance Power, Smart Metering, Computing, Lighting, Industrial Power, and Display Power utilizing the latest digital and analog control and device technology. Silanna Semiconductor, headquartered in San Diego, CA, is a privately-held semiconductor company, and has global facilities supporting customers with design centers and offices in North America, Europe, Asia, and Australia.
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“Less than a year ago, we launched the SZ1101, the world’s first fully integrated Active Clamp Flyback Controller, to an incredible customer and industry response,” said Mark Drucker, CEO of Silanna Semiconductor. “This expansion into higher power and smaller form factors speaks to our core power density leadership. Silanna Semiconductor delivers AC/DC solutions with the highest Power Density and Efficiency while simultaneously delivering the greatest value and reduced BoM costs.”
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Pasternack Unveils New Line of In-Stock Miniature Surface Mount…
“Pasternack now offers a comprehensive selection of miniature SMT packaged noise sources to address the needs of designers for circuit board level proof-of-concept or prototype applications,” said Tim Galla, Senior Product Line Manager
IRVINE, Calif. (PRWEB) September 15, 2020
Pasternack, an Infinite Electronics brand and a leading provider of RF, microwave and millimeter wave products, has just released a new series of miniature SMT packaged noise sources that are ideal for built-in test equipment, dithering for increased dynamic range of A/D converters and as a source for bit error rate testing. Applications include communication systems, microwave radio, military and commercial radar, test and measurement, base station infrastructure and telecom data links.
Pasternack’s new noise sources include nine models with industry standard SMT gullwing pin and dual in-line pin (DIP) surface mount packaging options. They cover frequency ranges from 0.2 MHz to 3 GHz and provide a source of additive white gaussian noise (AWGN) with a crest factor of 5:1. The SMT gullwing pin models in this line feature high output ENR levels ranging from 31 dB to 51 dB. The DIP models boast a noise output power level of -5dBm. These rugged 50 Ohm designs require DC voltage levels of +12 Vdc or +15 Vdc and can operate over a wide temperature range of -55°C to +125°C.
“Pasternack now offers a comprehensive selection of miniature SMT packaged noise sources to address the needs of designers for circuit board level proof-of-concept or prototype applications. These products normally require 8-10 week lead times, but we are able to provide them quickly with same-day shipping and no minimum order quantity,” said Tim Galla, Senior Product Line Manager at Pasternack.
Pasternack’s new surface mount packaged noise sources are in-stock and available for immediate shipping.
For inquiries, Pasternack can be contacted at +1-949-261-1920.
A leader in RF products since 1972, Pasternack is an ISO 9001:2015 certified manufacturer and supplier offering the industry’s largest selection of active and passive RF, microwave and millimeter wave products available for same-day shipping. Pasternack is an Infinite Electronics brand.
About Infinite Electronics:
Based in Irvine, Calif., Infinite Electronics offers a broad range of components, assemblies and wired/wireless connectivity solutions, serving the aerospace/defense, industrial, government, consumer electronics, instrumentation, medical and telecommunications markets. Infinite’s brands include Pasternack, Fairview Microwave, L-com, MilesTek, Aiconics, KP Performance Antennas, PolyPhaser, Transtector, RadioWaves, ShowMeCables, INC-Installs and Integra Optics. Infinite Electronics serves a global engineering customer base with deep technical expertise and support, with one of the broadest inventories of products available for immediate shipment.
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Rockley listed among top 10 British tech companies to watch
10 September 2020
Rockley Photonics of Pasadena, CA, USA (formed in 2013 to develop a versatile, application-specific silicon photonics platform for optical integration in next-generation sensor systems and communications networks) has been listed in The Sunday Times’ ‘10 Tech Ones to Watch’ list for 2020, which identifies promising private British tech companies from a cross-section of industries that are well positioned to grow rapidly.
Rockley was formed in 2013 by a management team that has previously had success with two silicon photonics companies. Founder & CEO Andrew Rickman founded the first firm to commercialize silicon photonics, Bookham Technology (which had an IPO in 2000, became Oclaro in 2009 and is now a part of Lumentum), and later became chairman of Kotura (sold to Mellanox in 2013). Rockley has developed a highly versatile, third-generation silicon photonics platform specifically designed for the optical I/O challenges facing next-generation sensor systems and communications networks.
Rockley’s photonic technology platform was developed with a focus on high-volume manufacture of highly integrated optical/electronic devices for high-performance applications. Exploiting optimized waveguide dimensions, it is said to offer significant benefits over conventional solutions including the production of higher-density optical circuits, the ability to create more complex integration, better manufacturing tolerances, superior power handling, lower loss and higher-efficiency photonic IC interfaces. The firm says that its technology can be adapted to be application specific, while simplifying manufacturing, assembly, test and validation, and optimizing power, size and cost of complex optical systems.
Rockley is now delivering a new class of non-invasive sensor for health-related sensing and monitoring applications. Its technology enables personalized monitoring of a much larger set of physical and chemical biomarkers than those currently available.
Rockley also develops and supplies photonic chipsets for datacoms applications. Integrated photonics eliminate the need for traditional discrete components and deliver lower-cost, highly scalable solutions for data-center connectivity. It increases bandwidth density, delivers lower energy consumption and significantly reduces the issue of heat.
“Our technology is flexible and powerful and drives multiple applications for a wide range of high-growth market sectors, including consumer sensors, healthcare and data communications,” says Rickman.
Rockley has raised $165m from investors including Applied Materials, Morningside Technology Ventures and Ahren Innovation Capital. A total of $300m in equity and NRE (non-recurring engineering) funding has been raised to date to support commercialization of its unique technology platform.
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