As monolithic device scaling continues to wind down and evolve toward increasingly heterogeneous designs, it has created an inflection point for chip architects...
Attorneys from Greenberg Traurig's Mexico City office represented the Fondo de Apoyo a las Necesidades de Vivienda de los Trabajadores (FANVIT), an investment fund...
News: Microelectronics 3 November 2023 Efficient Power Conversion Corp (EPC) of El Segundo, CA, USA – which makes enhancement-mode gallium nitride on silicon (eGaN)...
IC designers are tasked with meeting specifications like robustness in SRAM bit cells where the probability of a violation are lower than 1 part-per-billion...
AI/ML can be thought about in two distinct and essential functions: training and inference. Both are vulnerable to different types of security attacks...
The lines between counterfeiting, security, and design flaws are becoming increasingly difficult to determine in advanced packages and process nodes, where the number of...
News: Suppliers 1 November 2023 ELEMENT 3–5 GmbH says that its innovative Next Level Epitaxy (NLE) technology enables the reduction of the total manufacturing...
A technical paper titled “3D NAND Flash Memory Cell Current and Interference Characteristics Improvement With Multiple Dielectric Spacer” was published by researchers at Myongji...
A technical paper titled “The K2 Architecture for Trustworthy Hardware Security Modules” was published by researchers at MIT Computer Science and Artificial Intelligence Laboratory...
