Power is a ubiquitous concern, and it is impossible to optimize a system’s energy consumption without considering the system as a whole. Tremendous strides...
A new technical paper titled “Warpage Study by Employing an Advanced Simulation Methodology for Assessing Chip Package Interaction Effects” was published by researchers at...
A technical paper titled “Electrical characterization of multi-gated WSe2 /MoS2 van der Waals heterojunctions” was published by researchers at Helmholtz-Zentrum Dresden Rossendorf (HZDR), TU Dresden,...
News: Microelectronics
15 March 2024
The UK has joined the European Union’s ‘Chips Joint Undertaking’ as a participating state, giving British semiconductor...
News: Optoelectronics
15 March 2024
Sivers Semiconductors AB of Kista, Sweden (which supplies ICs and modules for communications and sensor solutions)...
Patrick is an entrepreneur with a background in physics and metamaterials. Patrick sets the vision for the future of the Neurophos architecture and directs...
IC layouts go through extensive design rule checking to ensure correctness, before being accepted for fabrication at a foundry or IDM. There’s something called...
News: Microelectronics
14 March 2024
Worksport Ltd of West Seneca, NY, USA (an automotive accessory manufacturer developing clean energy solutions) has announced...
By Keith Felton and Todd Burkholder
The time of 3D integrated circuits (3D ICs) is here, and they will revolutionize the semiconductor industry and effect...