Arm’s Ilias Vougioukas presents new ways to improve on virtual to physical memory translation without breaking any of the pre-existing hardware or software.
Siemens’ Scot Morrison considers the current regulatory landscape for security of medical devices, including how device manufactures need to proactively implement a plan to find, assess, and respond to potential vulnerabilities.
Synopsys’ Rimpy Chugh and Paras Mal Jain looks at the problems that reset domain crossing errors can cause and why RDC verification strategies should be embedded in the full ASIC development workflow.
Cadence’s Paul McLellan looks at how online retail is starting to take over previous segments that missed the Internet’s initial blow to in-person stores.
Codasip’s Philippe Luc identifies four categories of processor bugs and how the process of finding them, and the consequences of not finding them, differ.
In a blog for Ansys, Electro Magnetic Applications’ Kevin-Druis Merenda, Greg Wilson, and Tim McDonald examine one of the major causes of anomalies in spacecraft and the challenges of mitigating electrostatic charge buildup on both the craft’s surface and internals.
SEMI’s Heidi Hoffman warns that just as the decline in U.S. semiconductor manufacturing unfolded over several decades, reshoring and reinvigorating the industry will also be measured in decades.
And don’t miss the blogs featured in the latest Manufacturing, Packaging & Materials newsletter:
Amkor’s Prasad Dhond details why choosing the right substrate design and surface plating process is key to ensuring supplier support.
Coventor’s QingPeng Wang explores potential design and manufacturing alternatives that avoid a large number of wafer runs.
Lam Research’s Vahid Vahedi shows why selective isotropic etch is vital to creating new gate-all-around structures.
SEMI’s Michelle Williams-Vaden examines ways to retain employees.
Brewer Science’s Jessica Albright explains how collaboration can help a business be a force for good.
The post Blog Review: March 23 appeared first on Semiconductor Engineering.
